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Silicon for

intelligent systems

CHIP DESIGN

Three-layer silicon stack with HBM memory and substrate interconnect.

INTERCONNECT

Micro-wire bonding and substrate routing for signal integrity at scale.

Next-generation GPU architecture for AI inference and high-performance rendering.

ESIVO-1 PRO

Silicon architecture built from first principles

for neural computation.

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TFLOPS FP16

Mixed-precision tensor operations for training and inference. Sustained throughput at rated TDP with no thermal throttling under continuous load.

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TFLOPS FP16

HBM3 memory interface with 819 GB/s per stack.

Four stacks operating in parallel with unified addressing and error correction.

The ESIVO-1 series is built for inference.

the critical moment where trained models become real-time decisions.
We optimize for throughput per watt, not benchmarks.

ESIVO-1 TECHNOLOGY

Deconstructed For Clarity.

Every component in the ESIVO-1 series exists because it serves a specific computational purpose.

Six Independent Engineering Systems Thermal, Cooling, Signal, Power, Compute, Memory Optimized In Isolation, Then Validated As One Architecture Where The Output Of Each Component Is The Exact Input The Next Component Requires.

ESIVO-1 ARCHITECTURE

The ESIVO-1 architecture unifies thermal, cooling, signal, power, compute, and memory into a single integrated stack...

Memory Bandwidth

Four 12-Hi stacks providing 819 GB/s per stack. 3D TSV interconnect with unified addressing and hardware ECC for error-free inference.

48GB HBM3 Memory

Silicon Architecture

Advanced process technology enabling 432 tensor cores in a compact die footprint with improved power efficiency per operation.

7nm Process Node

Thermal management
Vapor Chamber Heatsink
Active cooling
Axial Flow Fan
Memory Stack
HBM3 Memory
14-Layer Compute PCB
Axial Flow Fan
Power System
16-Phase VRM Array

ESIVO RESEARCH

The ESIVO research division operates

independently from product cycles

Every Component In The ESIVO-1 Was A Paper Before It Was A Product.

Silicon Photonics

Exploring optical interconnects for next-generation memory

bandwidth beyond electrical trace limitations.

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Optical Bandwidth Target

Sparse Computation

Hardware-optimized matrix operations for 2:4 structured sparsity
with zero accuracy loss in transformer inference.

FLOPS Retention

Thermal Dynamics

Vapor chamber simulation and material science for sustained 500W+
thermal envelopes in single-slot form factors.

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Target Resistance

Recent Publications

Research Is The Input. Silicon Is The Output. The Peer Review Process Is The Filter

That Ensures Nothing Reaches Production Without Validation.

COMPANY

Building the future of accelerated computing.

Since our founding in 2019, ESIVO has been dedicated to creating GPU architectures that redefine what's possible in AI and high-performance computing.

Team Members

Engineers, researchers, and innovators

from around the world

Series C Funding

Backed by leading venture capital

and strategic investors

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Founded

Pioneering next-generation GPU

technology since day one

LOCATIONS

Every ESIVO-1 was designed, validated, and manufactured

across three facilities operating under identical quality protocols.

San Francisco

Headquarters

Austin

R&D Center

Taipei

Manufacturing

Our mission is to accelerate the world's most important computational workloads

through innovative hardware design and engineering excellence.

ESIVO builds next-generation GPU

architecture for AI inference and

high-performance rendering,

Product

Company

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